As memory prices are expected to continue rising in the second quarter amid tight supply, both DRAM and NAND players remain cautious on when the bottleneck will ease. Central News Agency and Anue, citing Wallace C. Kou, president of NAND flash controller chipmaker Silicon Motion, report that the mem...

SanDisk is reportedly moving to establish a supply chain for HBF, a next-generation memory that stacks NAND. According to ETNews, sources say the company has begun engaging materials, components, and equipment partners to build out an ecosystem for an HBF prototype production line. It aims to introd...

Ahead of TSMC’s earnings call later this week, the spotlight is once again on its advanced packaging roadmap—and CoWoS is no longer the only story. According to Commercial Times, TSMC’s CoPoS (Chip-on-Panel-on-Substrate) pilot line has already begun tool deliveries to R&D teams in February...

Recently, a joint research team from the National University of Defense Technology and the Institute of Metal Research, Chinese Academy of Sciences, has made a major breakthrough in wafer-scale growth and controllable doping of a new class of high-performance two-dimensional (2D) semiconductor mater...

Although JEDEC is expected to ease height restrictions for HBM, raising the limit to around 900 micrometers (µm) from 775 µm in HBM4, the industry continues to search for ways to overcome the structural limits of conventional HBM architectures. According to ET News, a “Vertical Die”-based adva...