Ahead of Samsung and SK hynix’s January 29 earnings calls, a fresh wave of memory price hikes is sweeping the market, potentially giving a boost to their results. South Korean media The Elec and ETNews report that Samsung’s consumer DRAM and SSD prices have nearly doubled—or even tripled—ove...

Intel has reportedly made fresh progress in glass substrate technology, indicating that the company has not exited the space despite market speculation. According to Wccftech, Intel Foundry displayed a “Thick Core” glass substrate integrated with its EMIB packaging technology at this year’s NE...

China’s AI chip sector could be approaching another high-profile listing. According to Bloomberg, sources say Alibaba is preparing to take its chipmaking arm, T-Head, public. As an initial move, Alibaba is said to be restructuring the unit into a business partly owned by employees, before explorin...

As the HBM4 battle heats up this year, memory giants are ramping up HBM4E development, where custom HBM is expected to become one of the mainstreams. According to The Elec, Samsung’s custom HBM4E design is set to be completed by May–June 2026, with SK hynix and Micron on a similar timeline. T...

Intel and UMC are reportedly exploring a deeper partnership aimed at supporting AI-related applications. According to Economic Daily News, sources say Intel plans to license its proprietary “Super MIM” capacitor technology to UMC, a technology used in Intel’s next-generation angstrom-class pro...