Intel is expanding its advanced packaging footprint, as a company backed by Intel Capital is reportedly launching India’s first advanced 3D chip packaging facility. According to The Indian Express, the project—developed by U.S.-based 3D Glass Solutions (3DGS), in which Intel has invested, throug...

While the rapid expansion of major Chinese memory players has drawn growing market attention, Reuters reports that more than half of the equipment used in one of the new fabs may have been sourced from domestic suppliers, including key systems for vertical chip-layer stacking. If confirmed, this cou...

Huawei has launched its latest products, with its self-developed HyperSpace Memory technology drawing attention. According to MyDrivers, Huawei Executive Director Richard Yu states that the Huawei Pura 90 Pro Max will fully support this “super memory” feature. He notes that while the device is e...

A proposed acquisition of a Dutch technology firm by Chinese LED chipmakers has collapsed following opposition from U.S. authorities. According to South China Morning Post, China’s leading LED chipmaker Sanan Optoelectronics and its Malaysian partner have withdrawn their US$239 million all-cash of...

DDR5 price correction in China’s retail market raised concerns over a potential cooling in DRAM demand. However, citing German media outlet 3D Center via Wccftech, the trend appears less likely to persist, as DDR5 kits in Germany recorded a modest price increase in April following a brief decline ...