EUV lithography has become the cornerstone of advanced chip manufacturing, and as the foundry race intensifies at ever-smaller nodes, major players are accelerating the development of related technologies. According to Nikkei XTECH, TSMC has significantly ramped up its patent filings in semiconducto...

Southeast Asia is fast becoming a key semiconductor hub, particularly in advanced packaging, attracting major players to expand their regional footprint. Taiwan-based chip packaging giant ASE announced a strategic partnership with Analog Devices (ADI) on Oct. 21, signing a binding MoU to acquire ADI...

As data center expansion accelerates and cloud leaders shift focus from AI training to inference, demand for high-capacity memory is surging, fueling a swift recovery in the global NAND Flash market. According to ZDNet, sources indicate that Samsung Electronics has ramped up operations at its main N...

On October 15, a research team led by Professor Fang Lu from the Department of Electronic Engineering at Tsinghua University announced the successful development of “Yuheng,” the world’s first sub-ångström snapshot spectral imaging chip. The breakthrough has been published online in the pres...

Earlier reports had expected Samsung to debut HBM4 domestically at its Samsung Tech Fair from October 27–31. However, according to The Elec, the chip could appear in Korea sooner—at SEDEX 2025, opening on the 22nd in Seoul, alongside SK hynix’s HBM4 showcase. Representatives from both compa...