As the standard DRAM market experiences an unprecedented cycle of supply-demand imbalance, the shortage of DDR3 production capacity has become even more severe. According to a report from the Economic Daily News, with leading manufacturers like Samsung exiting DDR3 production, while demand for D...

According to the latest report by TheElec, though Samsung has been using thermal compression (TC) bonding until its 12-stack HBM, the company now confirms its belief that hybrid bonding is necessary for manufacturing 16-stack HBM. Regarding its future HBM roadmap, Samsung reportedly plans to prod...

According to a report from South China Morning Post, Wang Tao, Executive Director, Chairman of the ICT Infrastructure Managing Board at Huawei, recently stated at the World Semiconductor Conference and Nanjing International Semiconductor Expo that Huawei's advanced Ascend 910B AI chip achieves an ef...

The ongoing tightening of US restrictions on China's access to advanced chips and production equipment may have significant impact on China's semiconductor development progress. According to a report from Liberty Times, a top executive at Huawei, a Chinese tech giant, admitted that China's ambitious...

MediaTek is making further strides in AI applications, focusing on the integration of smartphones and AR/MR devices. According to a report from the Economic Daily News, they look to capitalize on the significant business opportunities presented by 3D imaging combined with generative AI for immersive...