[News] Samsung Reportedly Solves SOCAMM2 Warpage, May Gain Edge Over Micron, SK hynix in Mass Production Timeline
Samsung has reportedly resolved a key technical challenge in its SOCAMM2 design. According to ETNews, citing sources, the company has overcome the “warpage” issue, a major hurdle ahead of mass production of its next-generation AI server memory module, SOCAMM2 (System on Chip Advanced Memory Module 2). The report adds that Samsung addressed the issue by applying its internally developed next-generation low-temperature solder (LTS) technology.
As the report notes, warpage refers to the slight bending of components caused by heat during manufacturing and is primarily driven by mismatches in the coefficients of thermal expansion (CTE) between materials. SOCAMM2 is particularly susceptible, as it uses a structure in which LPDDR5X chips are assembled into a module and secured through bolt-based compression, increasing the risk of connection failures.
To address this, Samsung lowered the soldering process temperature from above 260°C to below 150°C, according to the report. By significantly reducing the peak temperature, the company was able to minimize thermal expansion mismatches.
SOCAMM2 is a key low-power memory module designed to work alongside HBM in NVIDIA’s next-generation AI platform, Vera Rubin. The report adds that by applying LTS to SOCAMM2, Samsung is viewed as gaining an edge over competitors in both development and mass production timelines.
In addition to temperature control, Samsung introduced several design improvements. According to the report, the die configuration was shifted from a dual-tower to a single-tower structure to enhance mechanical rigidity, while the thickness and thermal expansion properties of the epoxy molding compound (EMC) were optimized. High-precision simulation models were also used to improve warpage prediction accuracy.
SOCAMM2 Competition Heats Up Across Samsung SK hynix and Micron
The competitive landscape in the AI semiconductor market is rapidly expanding to SOCAMM2. The JoongAng reports that Samsung Electronics is strengthening its position as the first in the industry to begin mass production of 192GB SOCAMM2. Analysts cited by the report estimate that Samsung’s supply for NVIDIA could reach around 10 billion Gb, accounting for roughly 50% of demand. The company is expected to lead in supply share, supported by stable yields and performance achieved through its 10nm-class fifth-generation (1b) process.
As noted by TheElec, SK hynix is accelerating its transition to sixth-generation (1c) DRAM this year. The move to the 1c process is expected to support the expansion of its AI memory portfolio, including SOCAMM2. Meanwhile, The JoongAng reports that in early March, Micron had shipped the world’s first 256GB SOCAMM2 customer samples, marking an approximately 33% increase in capacity compared with the 192GB flagship products from Samsung Electronics and SK hynix.
Read more
- [News] SOCAMM War Heats up: Micron Ships 256GB SOCAMM2 Samples, Topping Industry Capacity
- [News] SOCAMM2 War Heats Up: Samsung Reportedly Delivers Samples to NVIDIA, Ramping Early 2026
(Photo credit: Samsung)
