[News] “China’s ASML” by 2030? SMIC, Naura and Other Chip Leaders Call for National Effort

China has been accelerating its push for semiconductor self-reliance amid U.S. restrictions, and a new article written by the country’s leading chip executives has outlined a strategic roadmap. According to South China Morning Post, top figures in China’s semiconductor industry co-authored the piece, calling for a nationwide effort to develop a domestic alternative to Dutch chip-equipment giant ASML in response to U.S. sanctions.

The authors include the co-founder of China’s largest foundry SMIC, along with leaders from Empyrean, the country’s leading EDA firm, and Naura, a major Chinese chip equipment supplier, as well as academic researchers.

As the report notes, the industry leaders state that while China has made “breakthroughs” in areas such as EUV lasers, dual-stage platforms, and optical systems, integrating these technologies through coordinated national efforts remains a challenge that must be addressed during the 15th Five-Year Plan period, which runs through 2030.

The tech leaders also note that an ASML EUV lithography machine contains more than 100,000 components sourced from around 5,000 suppliers, while ASML primarily acts as the system integrator. Building “China’s ASML,” they argue, would therefore require a coordinated national effort, including the pooling of financial and human resources.

At the same time, the report highlights the leaders’ view that China’s semiconductor industry remains “small, fragmented and weak.” The industry leaders say the sector includes more than 100 EDA developers, about 3,600 chip design firms, and over 180 companies focused on wafer-fabrication equipment.

The article, “Building an Independent and Controllable Integrated Circuit Industry System,” appeared in the February issue of the Chinese journal Science and Technology Review, the report adds. In it, the industry leaders say the U.S. has sought to contain China’s rise in three key areas: EDA tools used for chip design, silicon wafers, and manufacturing equipment—particularly EUV lithography technology.

China Continues EUV Efforts While Testing DUV as a Workaround

China’s efforts to develop domestic EUV lithography capabilities are continuing. According to Reuters, sources say China assembled a prototype EUV machine in late 2025 using components sourced from older ASML systems. The report adds that the Chinese government aims to produce functional chips with the prototype by 2028, though 2030 is widely viewed as a more realistic timeline.

Alongside its EUV efforts, China is also exploring DUV lithography as a potential workaround. According to Mydrivers, domestic firms have reported improvements in exposure performance, with Nanjing GIAI Optoelectronics reducing within-wafer linewidth variation from ±2.1 nm to ±0.8 nm, which could potentially improve yields by 5–8%. The report suggests this may indicate progress toward producing 3 nm chips using DUV, though mass production remains uncertain.

Read more

• [News] Decoding China’s Lithography Push to Challenge ASML: From SiCarrier to Alternative EUV Paths
• [News] China Reportedly Builds EUV Prototype Using Older ASML Components, Eyes 2028 Chipmaking

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