[News] SK hynix Reportedly Eyes 321-Layer QLC NAND in 2H26; Future of Solidigm IPO Uncertain

As SK hynix takes the lead in the HBM4 era, the memory powerhouse is reportedly accelerating its push into NAND—a segment long considered secondary. DealSite reports that the company plans to start shipping 321-layer Quad-Level Cell (QLC) NAND products in the second half of 2026 and significantly expand its sales share.

The report highlights that while most QLC demand has so far been met through subsidiary Solidigm, SK hynix is now ramping up capabilities at its headquarters to drive greater synergy. The report further notes the company has steadily increased NAND layer counts—from 176 to 238 to 321 layers—and is now broadening its focus from Triple-Level Cell (TLC) to include QLC products.

The strategic shift reportedly comes as enterprise QLC-based SSD demand and storage needs from major cloud providers surge. Yet, DealSite emphasizes that SK hynix remains cautious on major NAND capacity expansion, given higher per-unit conversion costs compared with DRAM and still-thin margins, leaving little incentive for costly investments.

On the other hand, Samsung is also ramping up its NAND ambitions. TechBrew reported in July that the tech giant has begun building a production line for its next-generation V10 NAND, boasting a massive 430-layer stack, with commercial shipments expected in the second half of 2026.

Solidigm Rumors

Meanwhile, SK hynix’s subsidiary Solidigm, acquired from Intel in 2021, is showing signs of a turnaround. DealSite notes that while the unit had posted sizable losses since its consolidation, the recent surge in the QLC market has fueled tangible improvements. In H1 2025, Solidigm recorded KRW 3.356 trillion in revenue and KRW 132 billion in operating profit, rebounding from a KRW 70.9 billion operating loss.

However, speculation is also swirling over SK hynix’s plans for Solidigm. DealSite reports that talks of a U.S. IPO have been put on hold, while Chosun Biz suggests the memory giant may be considering selling Solidigm, with SK Group internally weighing divestment strategies.

Production has been a key hurdle. As Chosun Biz points out, SK hynix initially aimed for Solidigm to manage both manufacturing and sales, potentially with a U.S. listing. But tighter U.S. rules on China complicated this setup, prompting the company to shift manufacturing to its Chinese unit, SK hynix Semiconductor Dalian, as per the report.

Read more

• [News] SK hynix Unveils 2029–2031 Roadmap Featuring HBM5, GDDR7-Next, and 400+ Layer NAND
• [News] SK hynix Unveils Next-Gen Memory Roadmap: Custom HBM, AI-DRAM, AI-NAND with Tech Giants

(Photo credit: SK hynix)