[News] NVIDIA Reportedly Plans 2027 HBM Logic Die Design to Gain Supply Chain Leverage Over TSMC, SK hynix

According to South Korean media outlet Hankyung, citing sources, NVIDIA is working to reinforce its position in the HBM value chain by taking on the design of the “logic die,” a core component of HBM, starting in the second half of 2027, while also planning to diversify where it sources them.

As the report highlights, industry sources see NVIDIA’s strategy as an effort to rebalance its relationship with critical partners like TSMC and SK hynix, curb their negotiating leverage, and keep supply costs in check.

The report underscores that SK hynix and other memory manufacturers have so far produced logic dies internally. However, the next generation, HBM4 — entering mass production in the second half of this year — is driving a transition to foundry-based production. SK hynix has tapped TSMC for this role, and industry sources believe Micron is poised to do the same, the report notes.

Industry sources explain that NVIDIA’s decision to design its own logic dies reflects a bid to reclaim control from memory makers like SK hynix. While it may still need TSMC to fabricate the chips, taking charge of the design gives NVIDIA leverage over specifications and supplier selection, according to the report.

Notably, as TrendForce observes, NVIDIA will first adopt standard HBM4e in the first half of 2027—supplied by SK hynix on TSMC’s 12nm process—before transitioning to customized HBM4e designs from the second half of 2027 through 2028, with SK hynix supporting production on TSMC’s 3nm node.

HBM4 Race Heats Up as Suppliers Vie for NVIDIA Orders

NVIDIA is also said to be stepping up its scrutiny of SK hynix, its largest HBM supplier. Whereas SK hynix declared its output “fully booked” last year, this time Micron was the first to announce a sell-out. According to the report, industry sources interpret the change as a sign of ongoing negotiations between NVIDIA and SK hynix over supply allocations.

At the same time, Sedaily notes that Samsung’s HBM4 samples, delivered to NVIDIA last month, have reportedly passed initial prototype and quality tests and are scheduled to enter the “pre-production (PP)” stage by the end of this month. If they clear this last validation step, sources say mass production could begin as early as November or December.

Looking further ahead, ZDNet, citing sources, notes that the decisive phase of the next-generation HBM race may come in the first quarter of next year, when NVIDIA is expected to complete final qualification tests for HBM4 mass production.

Read more

• [News] NVIDIA Reportedly Eyes Small-Scale HBM Base Die Production in 2027: Rattling Memory, Chip Markets
• [News] Samsung Reportedly Passes NVIDIA HBM4 Sample Test, 30% HBM3E Discount to Challenge SK hynix

(Photo credit: SK hynix)