[News] ASE Acquires WIN Semiconductors’ Facility for NT$6.5B to Meet Soaring Advanced Packaging Demand

According to Commercial Times, ASE said on the 11th that its subsidiary ASE Semiconductor will acquire a plant and related facilities from Taiwan’s GaAs foundry WIN Semiconductors in the Southern Taiwan Science Park, Kaohsiung, for NT$6.5 billion. Approved by the board, the purchase is aimed at expanding advanced packaging capacity to meet surging demand from high-end applications such as AI and HPC (high-performance computing).

Investors cited by the report say ASE’s acquisition of WIN Semiconductors’ plant signals strong confidence in future high-end assembly and testing demand amid AI adoption. TrendForce reports that the world’s top 10 OSAT companies generated US$41.56 billion in revenue in 2024, up 3% year-on-year, with ASE leading at US$18.54 billion and holding nearly a 45% share.

So far this year, ASE’s advanced packaging and testing businesses have performed strongly. As per the report, the company’s 2025 revenue target for these segments is US$1 billion higher than in 2024, with growth expected to continue beyond 2026.

Meanwhile, though the company expects its assembly and testing business to maintain growth momentum in Q3, exchange rate effects are likely to trim gross margin by 1 to 1.2 percentage points from the previous quarter, as Commercial Times points out.

In recent years, demand for advanced packaging has surged, and ASE has been actively expanding in this market. As highlighted by TechNews, the company has invested US$200 million in its first 600mm Fan-Out Panel Level Packaging (FOPLP) production line, with equipment installation set for Q2 and Q3 2025 and trial production expected by year-end.

Read more

• [News] FOPLP Heats Up: ASE, Powertech Expand; TSMC Reportedly Preps 2026 CoPoS Pilot Line
• Top 10 OSAT Companies of 2024 Revealed—China Players See Double-Digit Growth, Reshaping the Global Market Landscape, Says TrendForce

(Photo credit: ASE)