[News] SK hynix to Showcase 16-layer HBM3E Samples at CES 2025, along with eSSD, CXL Developments

South Korean memory giant SK hynix announced in late September, 2024, that it has begun mass production of the world’s first 12-layer HBM3E with 36GB. Now it seems that the company is making good progress on 16-layer products as well. According to its press release, SK hynix will showcase its 16-layer HBM3E prototype at CES 2025, held in Las Vegas from January 7 to 10.

Notably, SK hynix states that its HBM3E 16-layer products were officially developed in November, 2024. According to SK hynix, it leverages the advanced MR-MUF process to achieve a leading 16-layer configuration, effectively minimizing chip warpage and optimizing heat dissipation.

The 16-layer HBM3E product, according to the company, can improve AI learning performance and inference performance by up to 18% and 32%, respectively, compared to the 12-layer HBM3E.

A previous report from ETNews suggested that production tests for SK hynix’s 16-layer HBM3E are underway, targeting supply in the first half of 2025. Another Sedaily report, citing CEO Kwak No-jung, notes that SK hynix plans to begin mass production of HBM4 in the second half of 2025.

SK hynix’s top executives, including CEO and President Kwak No-jung, AI Infrastructure President Kim Joo-sun, and Chief Development Officer Ahn Hyun, will attend the event, according to the company.

In addition to the highly anticipated 16-layer HBM3E sample, SK hynix will also showcase a diverse range of AI memory products, including high-bandwidth memory (HBM) and eSSD, along with solutions tailored for on-device AI and next-generation AI memory, as per the press release. Other highlights at CES 2025 from SK hynix are as below:

Enterprise SSD

SK hynix will showcase high-capacity, high-performance enterprise SSDs to meet the growing demand from AI data centers. This includes the 122TB D5-P5336 SSD, developed by its subsidiary Solidigm last November, as per its press release.

Compute Express Link (CXL) and Processing in Memory (PIM)

SK hynix will also display other next-gen data center technologies, including CXL and PIM, along with modular solutions like the CMM-Ax and AiMX. Notably, according to its press release, CMM-Ax enhances CXL’s high-capacity memory expansion with added computational capabilities, boosting performance and energy efficiency for next-generation server platforms.

Read more

• [News] SK hynix Rumored to Deliver Major HBM Order to Broadcom in 2025
• [News] SK hynix Gears up for 16H HBM3E Mass Production in 2025, with Early Testing Showing Positive Results

(Photo credit: SK hynix)