[News] Huawei Reportedly Builds 122TB SSDs With New Packaging Tech Despite Limited 100+ Layer 3D NAND Access

Huawei is reportedly advancing proprietary packaging technology to boost high-capacity SSD density. According to BLOCKS&FILES, the company has produced 122TB SSDs despite lacking access to the latest 100+ layer 3D NAND from major suppliers.

The report notes that, with U.S. restrictions limiting access to advanced 3D NAND, Huawei has had to rely more heavily on domestic suppliers. As conventional TSOP or BGA packaging could leave its SSDs at a density disadvantage versus mainstream competitors, the company has focused on board-level packaging innovation to improve capacity density through tighter NAND integration.

As the report indicates, Huawei’s Die-on-Board (DoB) is a wafer-level packaging technology that mounts semiconductor dies, such as NAND dies, directly onto a base printed circuit board (PCB). In contrast, mainstream SSD suppliers, including Samsung with V-NAND, Kioxia and Sandisk with BiCS, and Micron, typically use multi-die stacking before mounting them onto a base PCB. This approach is commonly used in high-capacity SSDs built on multi-layer 3D NAND

DoB improves capacity density by 33%, although the number of stacked layers remains undisclosed. Still, the report notes that DoB has yet to bring Huawei on par with 245TB SSDs from Kioxia and other suppliers currently being tested by hyperscalers.

The technology has already been deployed in Huawei products, including the OceanStor Pacific 9926 AFA scale-out storage systems paired with OceanDisk QLC PCIe Gen4 SSDs. The report added that an analyst briefing at the Huawei ID Forum 2026 in Paris outlined SSDs with 61.44TB and 122.88TB capacities already in production, alongside a future 245TB version.

Looking ahead, inf.news highlighted Huawei’s LC560 AI SSD, designed for capacity with 245TB storage through a 36-layer stacking process and bandwidth of 14.7GB/s. The report said the design integrates an AI acceleration unit into the controller, enabling simultaneous storage and computing while reducing data transfer energy consumption by 80%.

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(Photo credit: Huawei)