AI reasoning, agentic workflows, and accelerated computing are transforming data centers into next-generation AI factories. As AI workloads scale from single servers to rack-scale systems and full data-center deployments, power delivery has become a critical enabler of system performance, efficiency...

Surging AI-driven electricity demand is making energy efficiency, rather than computing performance, the defining constraint on future chip development. According to Reuters, TSMC Senior Vice President of Business Development Kevin Zhang said at a conference in Amsterdam on May 28 that customers, fr...

Market chatter has been circulating that Samsung Electronics Chairman Jay Y. Lee made a discreet visit to Taiwan last week, reportedly aiming to secure foundry orders for IC design major MediaTek from TSMC. However, at MediaTek’s shareholder meeting on May 29, TechNews and Liberty Times, citing CE...

Huawei's Tau (τ) Scaling Law is attracting growing industry attention as the company pursues a different path toward advancing chip performance. According to TechNews, NVIDIA CEO Jensen Huang commented on Huawei’s newly proposed semiconductor principle, the Tau (τ) Scaling Law, on May 28 during ...

Just months after rolling out HBM4 shipments in early 2026, Samsung has begun providing samples of the industry’s first 12-layer HBM4E to major global partners, according to the company’s latest press release. Given that HBM4 shares the same 1c DRAM process and 4nm base die architecture as HB...