[News] TechFuture Awards 2025 Winners Announced —Driving Innovation and Shaping Intelligent Future

On November 27, TrendForce successfully hosted the “2026 Top 10 Technology Market Trends & TechFuture Awards 2025,” on which it unveiled annual outlook for wafer foundry, memory, AI server, compound semiconductor, energy storage, AI robotics and other core technology sectors, providing forward-looking insights into key industry developments and exploring potential opportunities emerging from the AI-driven data ecosystem.

At TechFuture Awards 2025 ceremony, TrendForce presented awards for a group of outstanding companies that have demonstrated exceptional performance in technological innovation, commercial deployment, and market influence.

Below is the full list of TechFuture Awards 2025 winners:

“Excellence Award in AI-integrated Manufacturing”：TSMC

As a global leader in advanced packaging, TSMC’s groundbreaking CoWoS technology has emerged as a strategic cornerstone powering the rapid expansion of AI industry. With the company’s comprehensive lineup of advanced packaging solutions tailored for leading AI chipmakers, and particularly, its decisive expansion of CoWoS capacity in response to surging AI demand, TSMC is laying a solid foundation for scalable global AI computing infrastructure and setting the direction for high-quality development in integrated semiconductor manufacturing.

(Photo credit: TrendForce)

“High-Performance Storage Leadership Award”：Samsung

As a dominant force in the memory industry, Samsung has been committed to pushing the limits of capacity and performance, creating high-scale memory product mix for scenarios spanning from mobile terminal to AI computing. Leveraging sustained technological advancements and its global manufacturing footprint, Samsung is precisely aligned with market needs and leading the next wave of high-performance, high-capacity memory innovation—empowering high-speed processing and seamless data flow at global scale.

(Photo credit: TrendForce)

“Liquid Cooling Storage Pioneer Award”：Solidigm

Amid soaring power and thermal challenges in data centers, Solidigm introduced the world’s first enterprise SSD supporting direct-to-chip cold-plate liquid cooling (DLC). By adopting single-sided direct-contact liquid cooling, the solution efficiently manages the thermal load of extreme PCIe 5.0 performance. This breakthrough not only tackles cooling challenges in high-density environments but also boosts computing and storage density for AI/ML and HPC workloads, paving a sustainable way for next-generation data centers.

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“Breakthrough Award in NAND Flash Reliability”：YMTC

By virtue of its groundbreaking Xtacking® architecture, YMTC has solidified its strategic leadership in 3D NAND technology and fundamentally redefined the industry standards for QLC reliability and data retention. The new Xtacking® 4.0 takes this even further — achieving superior energy efficiency and significantly enhanced QLC reliability and endurance — empowering next-generation AI data centers with unmatched storage competitiveness and delivering rock-solid, long-term stability for high-performance SSDs.

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“Annual Storage Innovation Excellence Award”：Kioxia

In reaction to the core demands of AI training scenarios—petabyte-scale data storage and ultra-high throughput—Kioxia has innovated from the ground up in chip manufacturing and advanced packaging/stacking technologies to achieve breakthrough capacities. Built on the high-density and high-efficiency advantages of its 8th-generation BiCS FLASH™, Kioxia has taken the industry lead by launching the LC9 245.76TB NVMe SSD. This single drive delivers performance equivalent to dozens of traditional memory devices while incorporating dual-port design and broad form-factor compatibility, dramatically simplifying topology, reducing deployment power consumption, and lowering overall TCO. The product has been widely deployed in large-scale AI server clusters, providing highly reliable storage support for LLM training, multimodal data lakes, and other intensive workloads, earning extensive market recognition.

(Photo credit: TrendForce)

“NAND Flash Technical Innovation Award”：SanDisk

SanDisk has shattered existing NAND flash performance barriers in 2025 by conquering ultra-low die warpage through a proprietary stacking architecture based on the cutting-edge BiCS technology and CBA (Chip-Bonded-Array) wafer-bonding processes, successfully achieving highly efficient 16-die stacking in a single package. True to its commitment to open standards, SanDisk partnered with SK hynix to set new open standards and establish an industry technical advisory committee. This collaborative efforts has driven significant cost reduction and performance gains while accelerating the evolution of the global NAND flash memory ecosystem — demonstrating leadership in NAND flash technology innovation.

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“Excellence Award in AI Server Contribution”：Huawei

As a leader in China’s AI server industry, Huawei continues building its core foundation through the dual engines of Kunpeng general-purpose compute and Ascend AI compute. Ascend 910B/910C processors deliver exceptional performance in 2025, while Kunpeng’s efficient memory scheduling resolves general-compute bottlenecks—forming the backbone of domestic AI servers. Looking ahead, the upcoming Ascend 950 series will deepen chip-system-supernode integration, offering high-reliability compute pools and low-latency interconnects for enterprise and CSP customers, advancing the path toward fully autonomous and controllable AI infrastructure.

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“China Power Semiconductor Pioneer Award”：Innoscience

Innoscience, a global forerunner in GaN process innovation and power device manufacturing, has become a key force driving the rise of China’s power semiconductor industry. Its high-performance GaN devices are broadly adopted across consumer electronics, home appliances, AI data centers, new-energy vehicles, and industrial applications—ushering in a new era of high-efficiency, intelligent power electronics.

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“Annual AIDC Green Energy Cornerstone Award”：Trina Storage

Trina Storage, with its five-dimensional “Generation-Grid-Load-Storage-Compute” coordination model, partnered with China Unicom to build the world’s first zero-carbon data center—the Sanjiangyuan Green-Energy Smart Computing Demonstration Microgrid. Powered by PV, wind power, energy storage, and computing facilities, the project delivers over 10 million kWh annually. The system ensures safety, efficiency, and intelligence, enabling “green energy–driven AI compute,” advancing China’s East-to-West Computing project, and establishing a new benchmark for AIDC-oriented energy storage.

(Photo credit: TrendForce)

“Award for Key Technologies in AI Robotics”：Paxini

Paxini has achieved groundbreaking progress in robotic tactile sensing, with 15 multidimensional sensing modalities, a self-developed bionic dexterous hand, and the world’s first VTLA embodied-intelligence model. These advancements drive major breakthroughs in tactile perception, fine-grained manipulation, and real-world humanoid robot deployment—underpinning the solid growth of the embodied-intelligence industry.

(Photo credit: TrendForce)