[News] Samsung Reportedly to Make Korean HBM4 Debut Tomorrow at SEDEX, SK hynix Also on Display

Earlier reports had expected Samsung to debut HBM4 domestically at its Samsung Tech Fair from October 27–31. However, according to The Elec, the chip could appear in Korea sooner—at SEDEX 2025, opening on the 22nd in Seoul, alongside SK hynix’s HBM4 showcase.

Representatives from both companies confirmed to The Elec that HBM4 will indeed be on display at the event. Visitors will be able to view the actual HBM4 modules after the VIP tour, the report adds.

As The Elec notes, Samsung is aiming to catch up with its rivals in the HBM4 era, reportedly using its 4nm foundry process for the logic die, while SK hynix sticks to TSMC’s 12nm-class technology. At the same time, Samsung is pushing further differentiation with its 1c-nm process for the HBM4 core DRAM—one generation ahead of SK hynix’s 1b-nm DRAM, according to the report.

SeDaily reported that Samsung is also scheduled to unveil HBM4 at its 2025 Samsung Tech Fair, taking place October 27–31 at the Samsung Semiconductor Complex in Yongin, Gyeonggi Province, noting that its 12-layer HBM4 is slated for mass production later this year.

TrendForce projects SK hynix to lead with 59% of HBM market share in 2025, while Samsung and Micron will each hold about 20%.

Read more

• [News] Samsung Reportedly to Reveal HBM4 at Tech Fair in Late October to Close Gap with Rivals
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(Photo credit: Samsung)