[News] Samsung Reportedly Passes NVIDIA HBM4 Sample Test, 30% HBM3E Discount to Challenge SK hynix

According to Sedaily, industry sources on the 20th said the HBM4 samples Samsung supplied to NVIDIA last month have passed initial prototype and quality testing and are set to enter the “pre-production (PP)” stage by the end of this month. If they clear this final validation step, mass production could begin as early as November or December, the report adds, citing sources.

HBM4 is slated for use in NVIDIA’s next-generation AI accelerator “Rubin,” the report notes. SK hynix, which delivered samples in March and shipped initial volumes in June, is set to begin mass production in October. If Samsung clears the PP phase, it could start production in November and narrow the gap with SK hynix, the report underscores.

Samsung Eyes HBM3E Shipments with Discounts to Challenge SK hynix

In addition to HBM4 passing NVIDIA’s initial tests, Samsung’s 12-layer HBM3E is reportedly expected to clear NVIDIA’s quality testing by the end of this month, paving the way for shipments to begin, SEDaily reports.

Notably, Samsung has reportedly offered to supply HBM3E for the H20 at prices 20–30% below SK hynix, the report says. As a result, NVIDIA is said to be requiring quality tests on Samsung’s HBM3E and HBM4 before finalizing  pricing agreement with SK hynix, according to the report.

TrendForce forecasts that Samsung’s aggressive pricing strategy—along with an expected ramp-up in HBM3E production in 2026 and targeted investments in its 1c-nm process—will likely exert significant downward pressure on HBM prices next year.

Beyond the Korean giants, Micron has unexpectedly become the first of the big three memory makers to hint at a full sell-out of its 2026 HBM supply, according to ZDNet and New Daily. On June 10, Micron announced it had shipped 36GB 12-Hi HBM4 samples to key customers, reportedly making it the second of the three major memory players to reach the HBM4 sample stage.

Meanwhile, in addition to the rivalry among the three memory giants, market rumors suggest NVIDIA has begun developing its own HBM base die, stirring concerns across the supply chain. According to the Commercial Times, the chip is expected to be built on a 3nm node, with small-batch trial production slated for the second half of 2027.

Read more

• [News] HBM Battle Heats Up: Micron Reportedly Hints 2026 Sell-Out, SK hynix Yet to Confirm
• [News] NVIDIA Reportedly Eyes Small-Scale HBM Base Die Production in 2027: Rattling Memory, Chip Markets

(Photo credit: Samsung)