[News] Hanmi Reportedly Eyes Hybrid Bonders by 2027, Says TC Bonders Sufficient for HBM4, HBM5

According to a report from ZDNet on July 15, Hanmi Semiconductor Chairman Kwak Dong-shin dismisses speculation that the company will adopt a hybrid bonder system for now, stating that Hanmi’s TC bonders are sufficient for HBM4 and HBM5, following JEDEC’s April decision to relax AI packaging thickness standards to 775μm.

Kwak also notes that hybrid bonders cost over 10 billion KRW each—more than twice the price of Hanmi’s TC bonders, as the report highlights.

Meanwhile, the report states that Hanmi is preparing for future demand by developing a hybrid bonder for HBM6, targeting commercial launch by the end of 2027. The company is also working on a fluxless bonder, which could be released as early as later this year, according to its roadmap.

Hybrid Bonding Gains Ground Despite Hanmi’s Reservations

In contrast to Hanmi Semiconductor Chairman Kwak Dong-shin’s stance, hybrid bonding is gaining traction as the next step in high-performance HBM production. Financial News previously reported that traditional TC bonding methods face yield challenges when stacking beyond 16 layers. Hybrid bonding, which directly connects chips without bumps, enables thinner stacks, more layers, reduced signal loss, and higher yields.

Several major players are now investing heavily in this technology. LG Electronics—an unexpected entrant in the sector—is developing hybrid bonders specifically for HBM, according to Sedaily.

Samsung is also building hybrid bonding tools through its equipment subsidiary SEMES. Sedaily notes that the company plans to begin trial production of sixth-generation HBM (HBM4) using hybrid bonding technology by the end of 2025.

Sedaily further notes that SK hynix is expected to adopt hybrid bonding for its HBM4E products. Meanwhile, Hanwha Semitek, a major TC bonder supplier to SK hynix, is ramping up its hybrid bonding R&D efforts.

Additionally, Dutch equipment maker Besi has already secured a strong foothold in the hybrid bonding market, according to The Korea Economic Daily.

Read more

• [News] LG Makes Bold Move in HBM Race with Hybrid Bonders, Reportedly Sets Sights by 2028
• [News] China’s YMTC Dominates Hybrid Bonding Patents, Pressuring South Korean Memory Giants Samsung and SK hynix

(Photo credit: Hanmi Semiconductor)