DRAM contract prices are expected to peak by late 2025, then decline as new capacity emerges. DDR4 faces critical long-term shortages. HBM3e prices soften, HBM4 maintains a premium, with Samsung leading HBM4 tech. AI server demand surges, driving early orders and new memory solutions like LPCAMM2.

Key Highlights

• Market Trend: DRAM contract prices are set to rise until late 2025, then decline starting early 2026 due to new process capacity. The spot market remains stable with low trading volume.
• DDR4 Shortage: Strong demand from cloud providers and Intel is causing severe DDR4 supply constraints, anticipating critical shortages and significant price increases.
• HBM Market Divergence: HBM3e prices are softening due to heightened competition, while HBM4 maintains a high premium for its advanced specifications, with Samsung currently leading HBM4 technology development.
• Samsung's Progress: Samsung's HBM3e is expected to secure key client orders, further strengthening its HBM4 partnership.
• Server Demand: Driven by AI workloads and concerns over memory shortages, major cloud service providers anticipate robust server memory demand for 2026, actively engaging in early procurement.
• LPCAMM2 Emergence: LPCAMM2 modular memory is an emerging trend for AI servers, offering low power consumption and modular advantages, with key clients planning large-scale adoption and diversifying suppliers.

Table of Contents

1. Market Update
2. TrendForce’s View
   • Quarterly Price Projections on DRAM

<Total Pages: 2>