US Export Control Updates Announced on January 16th Will Extend KYC Review Standards to Packaging Technologies

Last Modified

2025-01-16

Update Frequency

Aperiodically

Format

PDF

TrendForce indicates that the US export control updates on January 16th extend KYC review standards to packaging technologies and expand controls to logic ICs at 16/14nm and below, 3D NAND with 128+ layers, and specific DRAM specifications. New measures require stricter due diligence from foundries and OSATs and establish "Approved IC Designers" and "Approved Manufacturing and OSAT Companies" lists. While non-AI chip production may continue, these measures will increase difficulties for Chinese customers and could impact TSMC's revenue by 1-3%.

＜Total Pages：6＞

Sector: Semiconductors

Tag: DRAM 3D NAND OSAT Advanced Packaging Competitive Landscape Domestic Substitution Export Controls Geopolitical Risk Policy & Regulation Supply Chain Trade War TSMC