US Export Control Updates Announced on January 16th Will Extend KYC Review Standards to Packaging Technologies

Last Modified

2025-01-16

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TrendForce indicates that the US export control updates on January 16th extend KYC review standards to packaging technologies and expand controls to logic ICs at 16/14nm and below, 3D NAND with 128+ layers, and specific DRAM specifications. New measures require stricter due diligence from foundries and OSATs and establish "Approved IC Designers" and "Approved Manufacturing and OSAT Companies" lists. While non-AI chip production may continue, these measures will increase difficulties for Chinese customers and could impact TSMC's revenue by 1-3%.

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