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TrendForce reveals that sales of advanced packaging equipment are expected to grow by more than 10% in 2024, with the potential to exceed 20% in 2025. This growth is being driven by major semiconductor manufacturers’ ongoing expansion of advanced packaging capacity and the rapidly expanding global AI server market.
TrendForce’s latest findings reveal that the DRAM industry saw a significant revenue increase to US$22.9 billion in the second quarter of 2024—a QoQ growth of 24.8%. This surge was driven by expanded shipments of mainstream products that boosted revenue for most manufacturers. Contract prices remained on an upward trend in the second quarter, and due to geopolitical factors, the increase in conventional DRAM contract prices for the third quarter is now expected to exceed previous forecasts.
TrendForce’s latest report on enterprise SSDs reveals that a surge in demand for AI has led AI server customers to significantly increase their orders for enterprise SSDs over the past two quarters. Upstream suppliers have been accelerating process upgrades and planning for 2YY products—slated to enter mass production in 2025—in order to meet the growing demand for SSDs in AI applications.
TrendForce’s latest findings on HBM report that the HBM capacity per single chip is increasing significantly with the iteration of AI chips. Currently, NVIDIA is the largest buyer in the HBM market, and it is anticipated that NVIDIA’s procurement share in the HBM market will exceed 70% with the launch of products like Blackwell Ultra and B200A in 2025.
Despite recent rumors speculating on NVIDIA’s supposed cancellation of the B100 in favor of the B200A, TrendForce reports that NVIDIA is still on track to launch both the B100 and B200 in the 2H24 as it aims to target CSP customers. Additionally, a scaled-down B200A is planned for other enterprise clients, focusing on edge AI applications.
