Regarding the continuous struggle of its foundry business, Samsung has reportedly decided to make another move, as its semiconductor division (DS) plans to undertake a major organizational restructuring within the year, according to a report by Chosun Biz. Through the restructuring, DS Division P...

Recently, TSMC updated the progress of the expansion of its sub-2nm advanced process. On September 11, Hsu Mao-hsin, Director-General of Taiwan’s Central Taiwan Science Park Administration, announced the expansion of the Taichung Phase 2 park. Currently, 95% of the land required for TSMC’s pl...

In a last-ditch effort before the upcoming board meeting this week, Intel is said to be seeking assistance from the U.S. government. The latest report by CNBC notes that Intel CEO, Pat Gelsinger, turned to Commerce Secretary Gina Raimondo recently, expressing his disappointment with the heavy depend...

ACM Research, Inc., a provider of wafer processing solutions for semiconductor and advanced wafer-level packaging applications in China, announced on September 3rd the release of its Ultra C bev-p panel bevel etching tool for fan-out panel-level packaging (FOPLP) applications. This new tool is de...

While Samsung Electronics is said to be delivering an oversea workforce cut up to 30%, a report from Korean media outlet Business Korea on September 11th has added that persistent issues with its 2nm yield rate have led Samsung to decide to withdraw personnel from its Taylor, Texas plant, signaling ...