TSMC and Samsung are not just archrivals in the foundry market. They also confront each other in an emerging sector, the Fan-Out Panel-Level Packaging (FOPLP) technology. According to South Korean media outlet ETnews, the two semiconductor giants, while both eyeing FOPLP as a secret weapon to high-p...

Leading GPU manufacturer NVIDIA recently unveiled its vision for future AI chip designs featuring silicon photonics at the IEDM 2024 conference. According to a report from Business Korea, NVIDIA highlighted the potential of silicon photonics for chip-to-chip connections within AI data centers, drawi...

TSMC's first fab in Kumamoto, Japan, is set to commence mass production by the end of 2024. According to a report from Commercial Times, citing Nikkei, the initial orders are expected to be supplied to Sony Group and Denso Corporation. According to Yuichi Horita, President of Japan Advanced Semic...

According to a report from Wccftech, Samsung Electronics may consider partnering with external foundries to produce its Exynos 2500 processor for the first time. The Wccftech report, citing Korean media outlet The Bell, notes that while TSMC is not explicitly mentioned, it remains the only alternati...

United Microelectronics Corporation (UMC) is making significant strides in the advanced packaging sector, breaking new ground in a market traditionally dominated by TSMC. According to a report by Economic Daily News, UMC has secured a major advanced packaging order from Qualcomm for high-performance...