As reported earlier, the global provider of outsourced semiconductor packaging and test services, Amkor, has been set to establish its presence in Arizona, USA, providing advanced packaging services for Apple chips manufactured by TSMC. According to reports from South Korean media, the alliance f...

In an announcement on December 5th, Taiwan’s National Science and Technology Council(NSTC) has designated 22 technologies, such as IC manufacturing and heterogeneous integration packaging, as national core key technologies. This inaugural list prioritizes technologies with leading advantages and i...

Germany is currently caught in a budget dispute that led to the rejection of a planned multi-billion-euro official subsidy for semiconductor companies. Sources suggest that if the German government reduces the initially committed subsidy, TSMC might need to reopen discussions on its investment in a ...

The highly anticipated 18th International Microsystems, Packaging, Assembly, and Circuits Technology Conference, also known as IMPACT 2023, took place with grandeur from October 25th to 27th at Hall 1 of Taipei Nangang Exhibition Center. This prestigious event was co-organized by leading institution...

According to TechNews' report, after a prolonged period of price suppression in the mobile panel market, there has been an upswing in demand since the end of the second quarter, as customer inventories have reached a turning point. The report further quoted industry sources, stating that the incr...