Popular Keywords
TGV
News
2025-10-06
[News] China Advances TGV Glass Substrate Tech as BOE, ECHINT, and Peers Step Up
According to ijiwei, citing CNpowder, as chip packaging technology advances rapidly, glass substrate TGV (Through Glass Via) has emerged as a focal point of industry attention. Glass substrates are gaining attention for their superior heat dissipation, conductivity, and flatness. As noted by Commer...
- Page 1
- 1 page(s)
- 1 result(s)