As Intel gains traction with its 18A and 14A nodes, its advanced packaging business — particularly EMIB (Embedded Multi-die Interconnect Bridge) — is also drawing customer support amid tight substrate supply. Speaking at the J.P. Morgan Global Technology Conference, Intel CEO Lip-Bu Tan said sev...

Raw material prices are climbing, and the semiconductor substrate industry is feeling the strain as the cost of critical inputs continues to rise. According to ZDNet, South Korea’s substrate makers are facing mounting pressure from sharp increases in raw material prices. Citing industry sources, t...

LG Innotek announced that it has successfully developed the world’s first copper post (Cu-Post) technology and applied it to the mass production of mobile semiconductor substrates, according to its press release. As noted by TechNews, citing Tom’s Hardware, LG Innotek’s Cu-Post replaces the t...