Taiwan's semiconductor manufacturing is making strides in advanced process and packaging expansion. TSMC’s new 2nm fab in Kaohsiung will hold a tool-in ceremony this November, followed by equipment installations in December. Meanwhile, ASE’s Siliconware Precision Industries is set to expand adva...

The surging global demand for AI chips is straining advanced packaging capacity, driving a sharp focus on fan-out panel-level packaging (FOPLP) within Taiwan's semiconductor industry. According to a report by Commercial Times, major packaging and testing firms such as ASE and Powertech, alongside eq...

ACM Research, Inc., a provider of wafer processing solutions for semiconductor and advanced wafer-level packaging applications in China, announced on September 3rd the release of its Ultra C bev-p panel bevel etching tool for fan-out panel-level packaging (FOPLP) applications. This new tool is de...

Despite recent issues with NVIDIA's GB200 shipments, the market remains optimistic about long-term AI demand, and CoWoS capacity continues to be in short supply. According to a report from MoneyDJ, TSMC will assign orders of the initial stage of chip stacking in CoWoS packaging, Chip on Wafer (Co...

"It is not the shortage of AI chips, it is the shortage of our CoWoS capacity," replied TSMC Chairman Mark Liu during an interview in September last year, propelling this technology that TSMC had quietly cultivated for over a decade into a global spotlight. As per a report from TechNews, the hard...