According to a report from ZDNet, SK hynix is reportedly planning to ship HBM4 samples to NVIDIA as early as June 2025, with full-scale product supply expected to begin around the end of the third quarter. The report notes that NVIDIA initially planned to equip its next-generation high-performanc...

A report from Nikkei highlights that, despite U.S. restrictions, China’s share of the global memory chip market has risen from virtually zero to 5% in just five years. This rapid growth poses challenges to global giants like Samsung Electronics, SK hynix, and Micron. Notably, according to Trend...

Recently, U.S.-based memory giant Micron Technology announced the groundbreaking of a new HBM (High Bandwidth Memory) advanced packaging facility in Singapore. This facility will be the first of its kind in Singapore and is scheduled to begin operations in 2026. Starting in 2027, Micron’s advan...

According to Chosun Biz, Samsung Electronics has reportedly decided to cut NAND flash production at its Xi’an plant in China, its largest manufacturing base for the memory chips. The move appears to be a strategic effort to protect profitability as a global NAND oversupply persists, leading to a p...

The meeting between AI accelerator giant NVIDIA and HBM leader SK hynix may be one of the most anticipated events at CES 2025. Following the talks with NVIDIA CEO Jensen Huang, SK Group Chairman Chey Tae-won confirmed the company’s positive advancements in next-gen HBMs, saying that its chip devel...