Per a report from Reuters, Intel is said to be receiving the second new High-NA EUV equipment from ASML, costing EUR 350 million (~USD 383 million). According to Intel's earnings call on August 1, CEO Pat Gelsinger stated that Intel began receiving the first large equipment in December, and the i...

As the battle of HBM intensifies between memory giants, the competition of NAND is also heating up. According to a report by Korean media outlet etnews, SK hynix is developing 400-layer NAND flash memory, aiming to get the technology ready for mass production by the end of 2025. Citing sources fa...

Samsung Electronics, which has been surround by concerns that its HBM3e products are still struggling to pass NVIDIA’s qualifications, has confirmed in its second quarter earnings call that the company’s fifth-generation 8-layer HBM3e is currently undergoing customer valuation, and is scheduled...

According to a report from Bloomberg, the US is reportedly considering new measures and could unilaterally impose restrictions on China as early as late August. These measures would limit China's access to AI memory and related equipment capable of producing them. Moreover, another report from Re...

On July 30, 2024, SK hynix announced the launch of next-generation memory product, GDDR7, with the world's highest performance. SK hynix explained that GDDR is characterized by the performance specifically designed for graphic processing and high-speed property, which has gaining an increasingly ...