With the HBM4 era on the horizon and SK hynix and Micron preparing for production ramp-up from late 2025 through 2026, it is an ideal time to explore how HBM (High Bandwidth Memory) is built, its key advantages and technologies related, and why its manufacturing complexity drives high costs. Here’...

According to ETNews, sources say SK hynix intends to add about 20 EUV systems by 2027. The company reportedly has around 20 units, including some used for R&D, and the planned expansion could double that number within two years. With each system costing hundreds of billions of KRW, the total inv...

Memory giants are preparing additional price hikes amid a shortage fueled by the AI boom. Following Samsung and Micron, SK hynix—while holding off on a formal announcement—is reportedly negotiating with customers under a policy of adjusting prices according to market conditions, according to SeD...

As Samsung reportedly cleared NVIDIA’s qualification for its 12-layer HBM3E and races to catch up with other memory giants, SK hynix has fired up a pilot production line at its M15X facility in Cheongju, featuring 1b DRAM to meet growing HBM demand, according to The Bell. The company plans to m...

Micron Discusses HBM and Advanced Packaging in the AI Era Recently, Yulin Chang, Vice President of Advanced Packaging and Testing Operations at Micron Taiwan, outlined the development of HBM and advanced packaging in the AI era. Chang noted that in the past, GPU was connected to GDDR6 via PCB. To...