Subject


Samsung


2024-07-05

[News] Samsung Establishes New HBM Team to Advance HBM3, HBM3e and HBM4 Development

In order to address the growing demand for high-performance memory solutions fueled by the expansion of the artificial intelligence (AI) market, Samsung Electronics has formed a new "HBM Development Team" within its Device Solutions (DS) Division to enhance its competitive edge in high-bandwidth mem...

2024-07-05

[News] AI Boom Expected to Boost Samsung’ Q2 Profit, Soaring to USD 6.34 Billion

According to a report from Reuters on July 4, consensus from 27 analysts compiled by LSEG SmartEstimate indicates that driven by the surge in demand for AI technology and the resulting rebound in memory prices, Samsung Electronics' operating profit for Q2 2024 (ending June 30) is projected to skyroc...

2024-07-04

[News] TSMC Reportedly Secures 3nm Order After Tapeout for Google’s Tensor G5

Google’s Tensor G4 could mark Samsung's last mass-produced SoC, as earlier in May, Tensor G5 is reportedly adopting TSMC’s advanced 3nm process. Now here’s the latest development. According to a report by Wccftech, the chip, to be used in Google’s upcoming Pixel 10 lineup, has already reache...

2024-07-04

[News] Samsung’s HBM3e Reportedly Passed NVIDIA’s Certification Though It Denies the Rumor

In early June, NVIDIA CEO Jensen Huang revealed that Samsung’s High Bandwidth Memory (HBM) is still striving on the certification process, but is one step away from beginning supply. On July 4th, a report from Korea media outlet Newdaily indicated that Samsung has finally obtained approval from th...

2024-07-02

[News] Huawei and XMC Collaborate to Develop HBM, Looking to Break Through U.S. Sanctions

According to a report from the Korean media outlet The Chosun Daily, Chinese company Huawei plans to collaborate with memory manufacturer Wuhan Xinxin Semiconductor Manufacturing Co. (XMC) to produce High Bandwidth Memory (HBM) semiconductors. Additionally, Jiangsu Changjiang Electronics Technology...

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