As per a report from Korea Economic Daily citing unnamed sources on July 15th, Samsung Electronics is preparing to mass-produce the logic die for HBM4 using its advanced 4nm process. The logic die, situated at the bottom of the chip stack, is a core component of HBM. Memory manufacturers are alr...

Though Samsung has denied the rumor that its HBM3e passed NVIDIA’s qualification tests, multiple Taiwanese companies in the supply chain reportedly learned that the product is expected to receive certification soon, and will start shipping in Q3. As memory manufacturers are said to shift at least ...

As top memory giants and AI chip companies all gear up for the combat of next-gen high bandwidth memory (HBM), JEDEC, the leader in the development of standards for the microelectronics industry, revealed the preliminary specifications of HBM4 last week. According to its press release and a report f...

The semiconductor industry, driven by AI, is entering a new upward cycle. According to a forecast report from SEMI, after the trough in 2023, the total sales of equipment in 2024 will hit a new high, with growth momentum continuing into 2025. Among this trend, per a report from Commercial Times, ma...

While still working in the final stage of HBM3e qualification with NVIDIA, Samsung Electronics is also advancing in the AI memory market with custom high bandwidth memory (HBM) solutions. According to reports by PassionateGeekz and China Flash Market, the memory giant is collaborating with major cli...