After grappling with 2nm yield challenges and failing to lock in major clients, Samsung is making a bold comeback. According to Digital Daily and Reuters, the company has announced a massive foundry deal worth over 22.7 trillion won (nearly $17 billion)—a potential game-changer for its chip busine...

According to a ZDNet report citing industry sources on the 25th, leading global semiconductor back-end equipment manufacturers are expected to expand their HBM hybrid bonding operations in the second half of 2025. BESI Expects Rising Hybrid Bonding Orders in H2 2025 On July 24, Dutch equipment...

Samsung is reportedly weighing the use of either titanium or carbon fiber reinforced plastic (CFRP) for the backplate of next year’s Galaxy Z Fold 8, according to The Elec. According to the report, sources say CFRP was reconsidered as an option due to uncertainties surrounding the U.S.–China ...

With JEDEC unveiling the LPDDR6 standard on July 9, memory giants are racing to meet soaring demand from mobile and AI devices. Notably, according to industry sources cited by Commercial Times, DDR6 is expected to enter large-scale adoption by 2027. Leading DRAM makers, including Samsung, Micron,...

With NVIDIA said to be aiming to procure up to 800,000 SOCAMM units this year, a new battleground is emerging among the top three memory giants. U.S.-based Micron appears to be leading the charge, having reportedly started SOCAMM module production for NVIDIA. Meanwhile, Samsung and SK hynix are acti...