In mid-August, Samsung is said to be accelerating its progress on next-gen HBM, targeting to tape-out HBM4 by the end of this year. Now it seems SK hynix has maintained its competitive edge, as the company aims to tape out HBM4 in October, which will be used to power NVIDIA's Rubin AI chips, accordi...

Amid the AI boom driving a surge in demand for advanced packaging, Samsung Electronics announced in March its ambition to achieve record-high revenue for the business this year, aiming to surpass the USD 100 million mark. The company, which is eager to catch up with TSMC not only on the foundry bu...

According to a report from Korean media outlet BusinessKorea, Rebellions' CTO Oh Jin-wook announced that the company will adjust its production plans, bypassing the initially planned Rebel 'Single' product to focus on the mass production of the Rebel Quad AI chip by the end of the year. This chip...

According to a report from the Commercial Times, SK hynix is expected to announce a plan of closer collaboration with TSMC and NVIDIA during the Semicon Taiwan exhibition in September, which is likely to focusing on the development of next-generation HBM. This partnership is expected to further st...

Earlier in June, Samsung updated its roadmap in the Angstrom era, stating that its 2nm node optimized with backside power delivery network (BSPDN), referred to as SF2Z, will enter mass production in 2027. Now, according to the latest report by the Korea Economic Daily, compared with the traditional ...