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    2026-06-05

    [News] Glass Substrates Eye 2027 Launch, Scale Toward 2030 as CoWoS Costs Rise and Hyperscaler Demand Grows

    Semiconductors

    As AI chips continue to scale in size and complexity, demand is rising for next-generation packaging and substrate solutions, with glass substrates emerging as a focal point. According to Sisa Journal, the technology is expected to begin early commercialization in 2027, move through a ramp-up phase ...

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