Subject


Saimemory


2026-05-22

[News] PSMC Joins Intel, SAIMEMORY to Demo 9-Layer Via-in-One Architecture for High Bandwidth 3D Memory

As Intel's collaboration with SoftBank subsidiary SAIMEMORY on Z-Angle Memory (ZAM) continues to draw intense industry attention, new details are emerging ahead of the VLSI Symposium 2026 scheduled for June. According to a pre-release summary leaked from the VLSI official session listing, Taiwan...

2026-04-30

[News] Intel, SoftBank Reportedly to Unveil ZAM-Based HB3DM in June, Bandwidth More Than Double HBM4

Intel is collaborating with SoftBank’s subsidiary SAIMEMORY to advance a potential alternative to conventional high-bandwidth memory (HBM). According to TechPowerUp, SAIMEMORY plans to present a paper at VLSI Symposium 2026 in June, detailing its newly developed HB3DM memory based on Z-Angle Memor...

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