Subject


Onsemi


2026-06-08

[News] Onsemi Reportedly Plans Up to 300 Job Cuts in Czech Plant as Low-cost Chinese SiC Competition Intensifies

Amid intensifying competition from Chinese players, Onsemi is reportedly under mounting pressure, with up to 300 job cuts planned at its Rožnov pod Radhoštěm plant in the Czech Republic, according to local media outlet e15. The move follows an earlier round of layoffs in 2025, when the US-based S...

2026-04-02

[News] onsemi Sets Shanghai as China HQ, Reportedly Eyes 50% BOM Localization

As STMicroelectronics moves to address rising chip demand in China through its partnership with local foundry Huahong, another major chipmaker is also stepping up its China push. According to Jiemien News and IT Home, onsemi has designated Shanghai as its Greater China headquarters, alongside pla...

2025-12-22

[News] GF, onsemi Join Forces to Co-Develop GaN Power Devices, Accelerating Ambitions with Samples Due 1H26

Global IDM leaders are charting contrasting strategies in the GaN sector. NXP reportedly plans to phase out its radio power product line and close its GaN RF fab in Arizona by 2027, while onsemi is taking an aggressive approach, partnering with GlobalFoundries to co-develop and produce advanced GaN ...

2025-12-04

[News] onsemi Partners With China’s Innoscience on Low/Mid-Voltage GaN, Sampling Expected in 1H26

onsemi and Innoscience signed a memorandum of understanding (MoU) on December 2 to speed up the deployment of GaN power devices, starting with 40–200V offerings. onsemi expects sampling to begin in the first half of 2026, as noted in its press release. The partnership aims to combine onsemi’s ex...

2025-12-01

[News] Onsemi to Receive €450M Government Grant for Advanced SiC Power Device Fab in Czech Republic

On November 21, the European Commission officially approved a state aid measure for the Czech Republic, authorizing a direct grant of approximately Euro 450 million to onsemi, specifically supporting the company’s next-generation silicon carbide (SiC) power device integrated manufacturing facility...

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