Global IDM leaders are charting contrasting strategies in the GaN sector. NXP reportedly plans to phase out its radio power product line and close its GaN RF fab in Arizona by 2027, while onsemi is taking an aggressive approach, partnering with GlobalFoundries to co-develop and produce advanced GaN ...

onsemi and Innoscience signed a memorandum of understanding (MoU) on December 2 to speed up the deployment of GaN power devices, starting with 40–200V offerings. onsemi expects sampling to begin in the first half of 2026, as noted in its press release. The partnership aims to combine onsemi’s ex...

On November 21, the European Commission officially approved a state aid measure for the Czech Republic, authorizing a direct grant of approximately Euro 450 million to onsemi, specifically supporting the company’s next-generation silicon carbide (SiC) power device integrated manufacturing facility...

Ahead of a new round of U.S.-China trade talks in Spain from September 14 to 17, Beijing has stepped up pressure on Washington. On Saturday, China’s Ministry of Commerce announced anti-dumping investigations targeting U.S. analog chips from Broadcom, Texas Instruments, Onsemi, and ADI, according t...

Once a rising star alongside AI chips, power semiconductors are now feeling the heat from a sluggish EV market. According to ijiwei, citing Nikkei, major players are slashing jobs and pushing back investments, with layoffs topping 8,800. Power semiconductors, vital for EV range and home appliance...