On November 13, NVIDIA unveiled the AI computing platform HGX H200, featuring the Hopper architecture, equipped with H200 Tensor Core GPU and high-end memory to handle the vast amounts of data generated by AI and high-performance computing. This marks an upgrade from the previous generation H100,...

Mainland China's 3D NAND flash memory manufacturer, Yangtze Memory Technologies Co. (YMTC), filed a lawsuit against the U.S. memory chip leader, Micron Technology, on November 9th in the Northern District Court of California. The lawsuit accuses Micron of infringing upon eight of YMTC's U.S. patents...

In a subdued environment for consumer electronic applications in the storage market, High Bandwidth Memory (HBM) technology is emerging as a new driving force, gaining significant attention from major players. Recent reports reveal that both Samsung and Micron are gearing up for substantial HBM prod...

Micron has announced a significant expansion in Penang, Malaysia on October 13th. Micron had previously invested $1 billion in Penang and plans to invest another $1 billion over the coming years for the construction and equipping of a state-of-the-art assembly and testing facility. This expansion is...

Amidst the AI boom, HBM technology steps into the spotlight as market demand continues to surge. Global market research firm TrendForce anticipates a 58% year-on-year increase in HBM demand in 2023, with a potential additional growth of approximately 30% in 2024. Compared to traditional DRAM, HBM...