Subject


Micron


2024-06-13

[News] HBM Supply Shortage Prompts Micron’s Expansion, Expected Schedule in Japan and Taiwan Revealed

Earlier, a report from a Japanese media outlet The Daily Industrial News indicated that memory giant Micron planned to build a new DRAM plant in Hiroshima, with construction scheduled to begin in early 2026 and aiming for completion of plant buildings and first tool-in by the end of 2027. Acco...

2024-06-13

[News] SK hynix to Kick off Mass Production for GDDR7 in Q4 2024

SK hynix, as the market leader in HBM, targets to begin mass production of its GDDR7 chips in the fourth quarter of 2024, the company said on 13th June. In the meantime, Micron also announced the launch of its GDDR7 graphics memory at Computex, which is currently being sampled. According to Anan...

2024-06-12

[News] DDR3 Price Rebound Expected in the Upcoming Quarters, Benefiting Taiwanese Manufacturers

As the standard DRAM market experiences an unprecedented cycle of supply-demand imbalance, the shortage of DDR3 production capacity has become even more severe. According to a report from the Economic Daily News, with leading manufacturers like Samsung exiting DDR3 production, while demand for D...

2024-06-07

[News] VIS, NXP to Build a 12-Inch Fab, Indicating Singapore’s Semiconductor Industry Concentration Further Enhances

Due to the impact of international situations and uncontrollable factors, the global semiconductor supply chain is undergoing a shift. According to a report from WeChat account DRAMeXchange, the Southeast Asian region, with its advantages in labor and development conditions, has become the preferred...

2024-06-07

[News] The HBM4 Battle Begins! Memory Stacking Challenges Remain, Hybrid Bonding as the Key Breakthrough

According to a report from TechNews, South Korean memory giant SK Hynix is participating in COMPUTEX 2024 for the first time, showcasing the latest HBM3e memory and MR-MUF technology (Mass Re-flow Molded Underfill), and revealing that hybrid bonding will play a crucial role in chip stacking. MR-M...

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