As 2025 begins, among the three major end-application markets for memory, the recovery momentum for mobile phones and laptops remains weak. Meanwhile, servers, driven by the strong demand for AI continue to grow steadily, which is expected to further drive semiconductor development. AI presents n...

According to a report from ZDNet, SK hynix is reportedly planning to ship HBM4 samples to NVIDIA as early as June 2025, with full-scale product supply expected to begin around the end of the third quarter. The report notes that NVIDIA initially planned to equip its next-generation high-performanc...

A report from Nikkei highlights that, despite U.S. restrictions, China’s share of the global memory chip market has risen from virtually zero to 5% in just five years. This rapid growth poses challenges to global giants like Samsung Electronics, SK hynix, and Micron. Notably, according to Trend...

As South Korean memory giant SK hynix claimed that its HBM development speed has surpassed NVIDIA’s request, U.S.-headquartered Micron is also working on the next-gen HBM product at full throttle. According to a report from ETNews, Micron is currently conducting final equipment tests for the HBM3E...

Recently, U.S.-based memory giant Micron Technology announced the groundbreaking of a new HBM (High Bandwidth Memory) advanced packaging facility in Singapore. This facility will be the first of its kind in Singapore and is scheduled to begin operations in 2026. Starting in 2027, Micron’s advan...