While Samsung races full steam ahead with its 12hi HBM3e validation and HBM4 development, Micron stays under the radar. But according to New Daily, the U.S. memory giant is quietly gaining ground—its 12hi HBM3e yields are rapidly improving, earning rave reviews from major CSPs. Citing Micron’...

Recently, Micron Technology announced that it is sampling the industry's first mobile UFS 4.1 and UFS 3.1 products based on its G9 NAND technology, aimed at enhancing the user experience on flagship smartphones. The Micron G9-NAND-based UFS 4.1 delivers faster speed and lower latency. Compared to...

As memory giants gear up for the next-gen HBM battle, JEDEC has officially released the JESD270-4 HBM4 standard in mid-April. With AI models and HPC workloads demanding faster, larger memory, HBM4 is arriving just right on time. As per JEDEC’s press release, one of the major improvements in HBM...

As the HBM race heats up, TC (thermal compression) bonders, which stack chips onto processed wafers by employing thermal compression to bond, are in hot demand. Memory giants are scrambling to lock in orders, and according to Money Today, Hanmi Semiconductor is seeing a surge in overseas interest, e...

As the HBM race heats up among memory giants, TC (thermal compression) bonders are taking center stage. Notably, recent developments involving key player Hanmi Semiconductor, Micron, and SK hynix have sparked attention—and could potentially reshape the memory landscape, according to reports from T...