On May 14, Rambus announced the launch of a complete lineup of next-generation AI PC memory modules, specifically designed for client chipsets. This includes two new power management IC (PMIC) tailored for client-side computing: the PMIC5200 for LPDDR5 CAMM2 (LPCAMM2) memory modules and the PMIC5120...

As Samsung advances HBM3E validation with key clients like NVIDIA, it is also targeting the next-gen mobile DRAM market. According to The Bell, the company is developing Low Power Wide I/O (LPW) DRAM with multiple partners, including Apple, to meet the growing demand for on-device AI. The Bell in...