As Lam Research announced the establishment of its Panel-Level Packaging Center of Excellence (CoE) in Salzburg, Austria, attention has turned to its customer and partner ecosystem. According to EE Times Japan, Yasumitsu Orii, head of Rapidus’ engineering center, delivered a congratulatory vide...

The U.S. has reportedly halted shipments of semiconductor equipment to facilities operated by China’s second-largest foundry, Hua Hong. According to Reuters, citing sources, the U.S. Department of Commerce has sent letters to several companies, including Lam Research, Applied Materials, and KLA, n...

As U.S. curbs continue to reshape supply chains, China is accelerating its push for semiconductor self-sufficiency and increasingly sourcing critical chipmaking tools from outside the U.S. According to Nikkei, imports of such equipment from Malaysia and Singapore surged in 2025, surpassing shipments...

BESI, an industry leader in hybrid bonding technology critical to HBM packaging, is reportedly attracting takeover interest. According to Reuters, sources say BE Semiconductor (BESI) has received takeover approaches as demand for its chip-packaging technology has become increasingly important for se...

As back-end processes take on a larger role in the AI chip era, advanced packaging equipment is rising in strategic importance. According to Hankyung, leading chip equipment makers—including ASML, Applied Materials, Tokyo Electron (TEL), and Lam Research—are moving decisively into the advanced p...