As U.S. curbs continue to reshape supply chains, China is accelerating its push for semiconductor self-sufficiency and increasingly sourcing critical chipmaking tools from outside the U.S. According to Nikkei, imports of such equipment from Malaysia and Singapore surged in 2025, surpassing shipments...

BESI, an industry leader in hybrid bonding technology critical to HBM packaging, is reportedly attracting takeover interest. According to Reuters, sources say BE Semiconductor (BESI) has received takeover approaches as demand for its chip-packaging technology has become increasingly important for se...

As back-end processes take on a larger role in the AI chip era, advanced packaging equipment is rising in strategic importance. According to Hankyung, leading chip equipment makers—including ASML, Applied Materials, Tokyo Electron (TEL), and Lam Research—are moving decisively into the advanced p...

According to Nikkei, earnings among leading chipmaking equipment makers are beginning to diverge, shaped by weakening sales in China and rising demand for AI chips. The report highlights that the combined net profit of the top ten chipmaking equipment makers remained robust, rising about 40% to $...

After imposing reciprocal tariffs on global trade, U.S. President Donald Trump has recently expressed plans to implement sweeping tariffs on semiconductor products. According to Reuters, if these semiconductor tariffs are enacted, they are expected to severely impact U.S. semiconductor equipment man...