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ASML EUV Dominance & China’s Semiconductor Equipment Push
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[News] Apple Reportedly Sources 60–70% of iPhone 17 LPDDR5X from Samsung, Eyeing iPhone 18 Volumes
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[News] SK hynix Reportedly Plans First U.S. 2.5D Packaging Line, Eyes Turnkey HBM to Challenge TSMC

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    • interposer

    In-Depth Analyses

    2023-07-06

    ASE, Amkor, UMC and Samsung Getting a Slice of the CoWoS Market from AI Chips, Challenging TSMC

    Emerging Technologies , Semiconductors

    AI Chips and High-Performance Computing (HPC) have been continuously shaking up the entire supply chain, with CoWoS packaging technology being the latest area to experience the tremors. In the previous piece, "HBM and 2.5D Packaging: the Essential Backbone Behind AI Server," we discovered that th...

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