As per sources cited in a report from Reuters, it's revealed that former Intel board member Lip-Bu Tan stepped down after just two years due to disagreements with CEO Pat Gelsinger and other board members. Two years ago, former Cadence Design Systems CEO Lip-Bu Tan was invited to join Intel's boa...

Earlier in June, Samsung updated its roadmap in the Angstrom era, stating that its 2nm node optimized with backside power delivery network (BSPDN), referred to as SF2Z, will enter mass production in 2027. Now, according to the latest report by the Korea Economic Daily, compared with the traditional ...

According to a report from UDN, TSMC held a groundbreaking ceremony yesterday for its Dresden, Germany plant, offering a significant boost to the EU's efforts to stabilize its chip supply. TSMC Chairman C.C. Wei led a team of top executives at the event, joined by key officials including German ...

As semiconductor giants, starting with Intel and TSMC, have been bringing in ASML’s High-NA EUV (high-numerical aperture extreme ultraviolet) equipment to accelerate the development in advanced nodes, the elite group has now reportedly been added two new members: Samsung and SK hynix. According...

NEO Semiconductor, a company focused on 3D DRAM and 3D NAND memory, has unveiled its latest 3D X-AI chip technology, which could potentially replace the existing HBM used in AI GPU accelerators. Reportedly, this 3D DRAM comes with built-in AI processing capabilities, enabling processing and gene...