According to Economic Daily News, Foxconn announced on May 19 a EUR 250 million investment in Europe. The plan includes forming a joint venture in France with Thales and Radiall to focus on advanced semiconductor packaging and testing (OSAT), along with a strategic partnership with Thales in the sat...

TSMC's fan-out (InFO) packaging process will no longer be exclusively used by Apple. According to a report from Commercial Times, it's revealed that Google's self-developed Tensor chips for their phones will switch to TSMC's 3nm process next year and will also start using InFO packaging. TSMC...