As semiconductor heavyweights spearheaded by TSMC accelerate panel-level fan-out packaging (FOPLP) development to revolutionize chip packaging efficiency, the technology is gaining significant traction. According to Commercial Times, supply chain sources reveal that FOPLP production equipment has be...

As fan-out panel-level packaging (FOPLP) gains traction among semiconductor leaders like TSMC, Japanese companies—long known for their materials expertise—are stepping into the spotlight as well. Resonac, according to Nikkei and its press release, has announced JOINT3, a joint development fra...

As semiconductor giants embrace fan-out panel-level packaging (FOPLP) for larger, more efficient chip designs, Japan’s Nikon is joining the race. The company has begun taking orders in July for its new DSP-100 digital lithography system, designed specifically for 600 mm square panels used in advan...

According to Economic Daily News, fan-out panel-level packaging (FOPLP) is regarded as the next mainstream technology in advanced packaging. Key industry players—including foundry giant TSMC, semiconductor packaging and testing leader ASE, and memory packaging powerhouse Powertech—are actively i...

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S....