Subject


DRAM


2024-08-28

[News] Micron to Acquire AUO Plants in Taiwan for HBM Expansion, Deal to Close by Year-End

Following TSMC's recent acquisition of Innolux's Tainan plant for NTD 17 billion, another Taiwanese panel maker, AUO, announced on August 27 that it will sell three idled manufacturing facilities in Tainan, Southern Taiwan as well, as memory giant Micron emerged as the buyer. Part of buildi...

2024-08-23

[News] HBM Technological Battle to be on the Next Level

Per a report by BusinessKorea, SK hynix Vice President Ryu Seong-su announced the company's strategic plan in the HBM field during the SK Group Icheon Forum 2024 held on August 19. SK hynix plans to develop a product that boasts dozen of times the performance of existing HBM technologies. The r...

2024-08-21

[Insights] Memory Spot Price Update: DDR4’s Price Hike Momentum Deterred by the Ample Supply of Reball Chips

According to TrendForce's latest memory spot price trend report, regarding DRAM spot prices, though the top three DRAM suppliers have not lowered their official prices, spot prices could weaken further because buyers are more passive than before. On the other hand, the ample supply of reball DDR4 ch...

2024-08-19

[News] Samsung Reportedly Bets on CXL Memory in the AI Race

According to a report from Nikkei, Samsung Electronics, currently lagging behind SK hynix in the HBM market, is said to be betting on the next-generation CXL memory, with shipments expected to begin in the second half of this year, while anticipating the CXL memory to become the next rising star ...

2024-08-16

[News] 3D DRAM with Built-in AI Processing – a New Tech Potentially Replace Existing HBM

NEO Semiconductor, a company focused on 3D DRAM and 3D NAND memory, has unveiled its latest 3D X-AI chip technology, which could potentially replace the existing HBM used in AI GPU accelerators. Reportedly, this 3D DRAM comes with built-in AI processing capabilities, enabling processing and gene...

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