NVIDIA unveiled its Blackwell architecture and the touted powerhouse AI chip GB200 at GTC 2024 held in San Jose, California, on March 19th. Manufactured using TSMC's 4-nanometer (4NP) process, it is expected to ship later this year. According to a report from TechNews, TSMC's CoWoS technology com...

According to sources cited by Reuters,  TSMC is reportedly considering plans to establish a production line for its CoWoS technology in Japan. However, TSMC has yet to make any further decisions, and they have declined to comment on the matter. CoWoS is an advanced packaging technology that stac...

The Executive Yuan and TSMC have reportedly reached a consensus on the investment project for the new advanced packaging plant at the TSMC Science Park in Chiayi. According to a report from Economic Daily News, six new plant sites will be allocated to TSMC in the Science Park, two more than original...

"It is not the shortage of AI chips, it is the shortage of our CoWoS capacity," replied TSMC Chairman Mark Liu during an interview in September last year, propelling this technology that TSMC had quietly cultivated for over a decade into a global spotlight. As per a report from TechNews, the hard...

With numerous cloud computing companies and large-scale AI model manufacturers investing heavily in AI computing infrastructure, the demand for AI processors is rapidly increasing. As per a report from IJIWEI, the demand for HBM (High Bandwidth Memory), a key component among them, has been on the ri...