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    • CoWoP

    News

    2025-07-30

    [News] CoWoP: A Game-Changer Beyond CoWoS—Or Just Hype? PCB Makers Stay Skeptical

    Semiconductors

    Fueled by booming demand for advanced packaging like CoWoS, a new report from China’s Wallstreetcn is turning heads with claims of a breakthrough “CoWoP” (Chip on Wafer on PCB) tech—mounting chips directly onto PCB mainboards via mSAP processes, skipping IC substrates entirely. However, Info...

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